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DFB+EML (double needles) chip tester

Classification:


This equipment is used in optical chip LD-CHIP high temperature/normal temperature LIV test, SMSR test and backlight sampling test, and different test results are classified and screened. Chip wafer blue film loading, CHIP-ID automatic recognition memory matching test, through the blue film thimble peeling mechanism, nozzle suction, manipulator respectively transported to high temperature and normal temperature test area, automatic positioning, automatic testing, analysis and screening, manipulator handling and classification. This equipment has the characteristics of high speed and high precision, and realizes the process of complex timing and strict logic. The equipment adopts eccentric cam drive, connecting rod and precision fixture and other mechanisms, with multi-axis motion, visual positioning, visual character matching and other technologies, with mass production capabilities.


  • Application
  • Characteristic
  • Specifications
  • Download
    • Commodity name: DFB+EML (double needles) chip tester
    • 型号: PSS CHIP22405 series
    • Describe: Compatible with DC, Pulse power-up

    This equipment is used in optical chip LD-CHIP high temperature/normal temperature LIV test, SMSR test and backlight sampling test, and different test results are classified and screened. Chip wafer blue film loading, CHIP-ID automatic recognition memory matching test, through the blue film thimble peeling mechanism, nozzle suction, manipulator respectively transported to high temperature and normal temperature test area, automatic positioning, automatic testing, analysis and screening, manipulator handling and classification. This equipment has the characteristics of high speed and high precision, and realizes the process of complex timing and strict logic. The equipment adopts eccentric cam drive, connecting rod and precision fixture and other mechanisms, with multi-axis motion, visual positioning, visual character matching and other technologies, with mass production capabilities.

    Product Application

    • The equipment is used for automatic test binning of bare chips, which can realize spectrum and LIV parameter testing of edge-emitting chips under low temperature conditions. 

     

  • Product Features  

    • Support the LIV, test of spectral related parameters, and test curves drawing of chip

     

     

    • Chip blue film automatic loading, automatic identification of chip ID through the vision system, test board support automatic secondary positioning of chip under the camera, and precise control probe power-on test

     

     

    • The probe automatically presses down and power-up, adjustable down-force of probe , the probe strength display synchronously
    • High temperature and normal temperature test station, temperature is closed-loop controlled

     

     

    • Loading and transit action are synchronized, normal temperature and high temperature loading table test is parallel to improve test efficiency, and loading nozzle adopts self-weight down-force, no damage to chip

     


    • Multi-dimensional adjustable measurement structure to meet users' needs for different specifications of chip measurement
    • Standard TO and chip can be calibrated and other process parameters can be set
    • Real-time dynamic prompts for important procedure in the production process
    • The material in contact with the chip adopts anti-static material and grounding treatment; The loading place is equipped with an electrostatic elimination ion fan
    • Software supports local and remote databases

  • Parameters

    Description/Value

    Chip Size

    Chip length 200-300μm; Chip width 150-300μm

    Other sizes can be customized

    Load size

    6-inch blue film ring, 4 blue film rings in the material unloading area, with automatic binning function

    Test Platform

    Normal temperature/high temperature test station to realize loading, position calibration and test in parallel

    Measurement parameters

    LIV curve,Ith,Po,Vf,Im,Rs,SE,Kink,spectral parameters, etc

    LD drive current

    Range 0-250mA, maximum 500mA can be customized, support pulse output

    Forward voltage test

    Range 0-5V

    Optical power test

    Test range 0-30mW; Wavelength range 900-1700nm (subject to spectrometer)

    Temperature control

    Room temperature 18-40 °C; High temperature 40-90 °C; Stability≤± 0.1 °c

    Test efficiency

    (typical)

    Single Chip≤6s (Single Spectral Point Test, AQ6360D)

    Power supply

    AC 220V/32A 50Hz