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Optical Module Burn-in System

Classification:


PSS 12016/22016/32016, an integrated burn-in system for optical modules, is used for burn-in and screening and reliability analysis of optical modules. The system provides a constant voltage of 3~4V and a high temperature burn-in condition of up to 120℃. At the same time, the working current, voltage and working environment temperature of the module are monitored and tested in real time, and the failure judgment is automatically made. Real-time storage of monitoring data is supported for tracing burn-in failure modules, and recording module voltage, temperature, bias current, transmit power and receive power through DDM.


  • Application
  • Characteristic
  • Specifications
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    • Commodity name: Optical Module Burn-in System
    • 型号: PSS MBS12016/22016/32016
    • Describe: Support multi-package type modules, COB burn-in

    PSS 12016/22016/32016, an integrated burn-in system for optical modules, is used for burn-in and screening and reliability analysis of optical modules. The system provides a constant voltage of 3~4V and a high temperature burn-in condition of up to 120℃. At the same time, the working current, voltage and working environment temperature of the module are monitored and tested in real time, and the failure judgment is automatically made. Real-time storage of monitoring data is supported for tracing burn-in failure modules, and recording module voltage, temperature, bias current, transmit power and receive power through DDM.

    Product Application

    • Support on-line burn-in screening (packaging is extensible) for modules of package types such as XFP, SFP+, SFP-Combo, SFP-DD, CFP, QSFP+, QSFP-DD and OSFP.
    • COB burn-in screening supporting multi-class encapsulation.
    • Support the strict requirements of high-speed module product testing.

     

     

     

  • Product Features

    • The maximum current of the whole board 24A is provided for the optical module or COB product.
    • High-power burn-in supports water cooling solution
    • High integration and high reliability, which is suitable for the burn-in process and reliability verification process of large-scale manufacturing of modules or COB products.

     

     

    • The incubator has two independent temperature zones, and supports the burn-in operation of many different products at the same time, with uniform temperature distribution and small module temperature difference.
    • Support current limiting protection, real-time protection of products, module power on and off, burn-in board hot plug EOS function is perfect.

     

     

    • Support real-time monitoring module and DDM of COB products to record voltage, temperature, bias current, transmit power, receive power, etc.
    • Support register writing of module and COB before burn-in (burn-in mode), and single product register debugging function.
    • The burn-in board is designed separately, and the QSFP and QSFPDD seats are separated into small boards, which is convenient for maintenance.
    • Real-time data storage, no need to worry about data loss caused by accidental power failure.

  • Parameter

    Description/Value

    Product model

    MBS12016

    MBS22016

    MBS32016

    Number of independent temperature zones

    two

    Number of test channels

    1008*2

    (Maximum 2016 channels, refer to product type, size and power consumption, select different types of burn-in boards and channels)

    Bin size

    Single bin supports 3*12 burn-in boards.

    Single bin supports 6*6 burn-in boards.

    Module package support

    Support XFP, SFP, QSFP, QSFP-DD, OSFP and other packages (the package is extensible).

    Voltage output range

    3~4V

    Voltage monitoring

    3~4V

    Current limiting range

    0~4A

    Current monitoring

    0~4A

    Maximum current of single board @3.3V

    12A

    12A

    24A

    I2C DDM data reading

    Support 8472 protocol, 8436 protocol and cmis4.0 protocol (extensible)

    Overcurrent protection

    Software configurable

    temperature range

    RT+30℃ ~ 120℃ (no-load)

    Temperature accuracy

    ±2℃

    Temperature uniformity [air]

    Full load ≤ 3℃, no load ≤ 2℃

    Long-term temperature stability

    ±1℃

    Heating rate

    >2℃/min

    database

    Real-time local storage, docking database

    power consumption

    ≤10kW (peak power consumption of equipment in heating-up stage, excluding products)

    Size (width * height * depth)

    1620*1850*1450(mm)

    1700*1900*1300(mm)