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Optical Chip Test
Key words:
DFB (single needle) chip tester
This equipment is used in optical chip LD-CHIP high temperature/normal temperature LIV test, SMSR test and backlight sampling test, and different test results are classified and screened. Chip wafer blue film loading, CHIP-ID automatic recognition memory matching test, through the blue film thimble peeling mechanism, nozzle suction, manipulator respectively transported to high temperature and normal temperature test area, automatic positioning, automatic testing, analysis and screening, manipulator handling and classification. This equipment has the characteristics of high speed and high precision, and realizes the process of complex timing and strict logic. The equipment adopts eccentric cam drive, connecting rod and precision fixture and other mechanisms, with multi-axis motion, visual positioning, visual character matching and other technologies, with mass production capabilities.
Key words:
DFB+EML (double needles) chip tester
This equipment is used in optical chip LD-CHIP high temperature/normal temperature LIV test, SMSR test and backlight sampling test, and different test results are classified and screened. Chip wafer blue film loading, CHIP-ID automatic recognition memory matching test, through the blue film thimble peeling mechanism, nozzle suction, manipulator respectively transported to high temperature and normal temperature test area, automatic positioning, automatic testing, analysis and screening, manipulator handling and classification. This equipment has the characteristics of high speed and high precision, and realizes the process of complex timing and strict logic. The equipment adopts eccentric cam drive, connecting rod and precision fixture and other mechanisms, with multi-axis motion, visual positioning, visual character matching and other technologies, with mass production capabilities.
Key words:
DFB+EML+SOA (three needles) chip tester
This equipment is used in optical chip LD-CHIP high temperature/normal temperature LIV test, SMSR test and backlight sampling test, and different test results are classified and screened. Chip wafer blue film loading, CHIP-ID automatic recognition memory matching test, through the blue film thimble peeling mechanism, nozzle suction, manipulator respectively transported to high temperature and normal temperature test area, automatic positioning, automatic testing, analysis and screening, manipulator handling and classification. This equipment has the characteristics of high speed and high precision, and realizes the process of complex timing and strict logic. The equipment adopts eccentric cam drive, connecting rod and precision fixture and other mechanisms, with multi-axis motion, visual positioning, visual character matching and other technologies, with mass production capabilities.
Key words:
Optional dual temperature stage + divergence angle test + polarization test
This equipment is used in optical chip LD-CHIP high temperature/normal temperature LIV test, SMSR test and backlight sampling test, and different test results are classified and screened. Chip wafer blue film loading, CHIP-ID automatic recognition memory matching test, through the blue film thimble peeling mechanism, nozzle suction, manipulator respectively transported to high temperature and normal temperature test area, automatic positioning, automatic testing, analysis and screening, manipulator handling and classification. This equipment has the characteristics of high speed and high precision, and realizes the process of complex timing and strict logic. The equipment adopts eccentric cam drive, connecting rod and precision fixture and other mechanisms, with multi-axis motion, visual positioning, visual character matching and other technologies, with mass production capabilities.
Key words:
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