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Reliability Test
Key words:
APD integrated burn-in system is used for reliability evaluation and burn-in screening of TO devices such as APD, APD-TIA, PIN, and PIN-TIA in the optical communication industry, and supports a single burn-in of up to 3072pcs. The system can provide 2mA constant current, 5V constant voltage and 175℃ high temperature burn-in conditions, while monitoring the VBR and TIA current of the device in real time, and automatically judge product failure. Real-time storage of monitoring data and support for tracing of burn-in and failed devices can effectively improve the efficiency and reliability of TO production, and greatly improve the output and quality of device testing.
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COC Drawer-type Burn-in System
PSS Drawer-type COC Burn-in System (PSS LRS13841) is commonly used for burn-in screening and lifetime reliability analysis of DFB, EML and EML-SOA chips. The system supports synchronous output of constant current (LD & SOA) and constant voltage (EA), and real-time monitoring of parameters such as current, voltage, optical power and temperature to automatically determine product failure. It supports local and remote databases for data analysis and traceability of failed devices.
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LD integrated burn-in system is used for burn-in screening and reliability life analysis of various types of packaged LD devices. The system can configure the pin definition through software and provide a drive current of up to 500mA and a high temperature burn-in condition of 150℃. At the same time, it can monitor and test the drive current, backlight current and threshold of the device in real time, and automatically judge the product failure. It stores monitoring data in real time and supports data tracing of burn-in and failed devices. It supports a single burn-in of up to 3072pcs.
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PSS EML TO integrated burn-in test system is used for burn-in screening and reliability life analysis of EML TO devices. The system supports burn-in of up to 1536-channel devices. It provides constant current for LD devices through external environmental temperature control or high temperature control of the internal TEC of the device to achieve burn-in of EML devices. The system can display parameters such as burn-in current, backlight current, forward voltage, EA current in real time and display them in graphical form, which is convenient for observing abnormal conditions during burn-in process. The universal burn-in board is compatible with our EML TO disk test system, significantly improving test efficiency and TO product quality.
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