Visible Laser Chip Tester-Module testing_TO testing

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Visible Laser Chip Tester

Classification:

This equipment is used for visible laser CHIP normal temperature PIV test and spectrum test and classifies and screens different test results. Chip blue film loading, automatic material search, identification and positioning are available. Chips are peeled off by a blue film ejector, sucked by a nozzle, and transported by a manipulator for visual recognition and position calibration and automatic power-on to collect luminous parameters, test PIV/spectrum, analysis and screening, manipulator transportation and classification to different blue film ranges. This equipment has the characteristics of high speed and high accuracy, and realizes complex timing and strict logic process. The equipment uses linear motors, high-accuracy module motion and cams, combined with technologies such as multi-axis motion, visual positioning and ORC recognition, having mass production capabilities.

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- Commodity name: Visible Laser Chip Tester
- 型号: PSS CHIP12806-P
- Describe: Visible laser chip single-station test, supporting tests of optoelectronic characteristics such as LIV, spectrum and divergence angle
This equipment is used for visible laser CHIP normal temperature PIV test and spectrum test and classifies and screens different test results. Chip blue film loading, automatic material search, identification and positioning are available. Chips are peeled off by a blue film ejector, sucked by a nozzle, and transported by a manipulator for visual recognition and position calibration and automatic power-on to collect luminous parameters, test PIV/spectrum, analysis and screening, manipulator transportation and classification to different blue film ranges. This equipment has the characteristics of high speed and high accuracy, and realizes complex timing and strict logic process. The equipment uses linear motors, high-accuracy module motion and cams, combined with technologies such as multi-axis motion, visual positioning and ORC recognition, having mass production capabilities.

Application
The equipment is used for automatic test binning of visible laser bare chips. The spectrum and LIV parameter testing of edge emitting lasers under normal/high temperature conditions can be realized

Features
1. Support testing of LIV and spectrum-related parameters of Chip, and draw test curves

2. Automatic loading of chip blue film, automatic identification of chip ID via the vision system, test bench supporting automatic secondary positioning of chip under the camera, and accurate control of probe power-on test

3. The probe is automatically pressed down for power-on, the probe pressure is adjustable, and the probe force can be displayed in real time
4. The unloading is equipped with 8 blue film trays and 4 2-inch GelPak boxes

5. The picking and handling mechanism (composed of loading and unloading nozzles, the handling axis controlled by high-precision linear motors) is provided with good stability and high movement accuracy

6. It can realize low-power and high-power testing: low-power test system (air cooling + TEC temperature control; 1-inch integrating sphere light collection, PIV, spectrum measurement), (reserved) high-power test system (water cooling + TEC temperature control; 3-inch integrating sphere light collection, PIV, spectrum measurement)

Specification