Data Communication Dual-station Chip Tester
Classification:
This equipment is used for high/normal temperature LIV testing, SMSR testing and backlight sampling of optical chips LD-CHIP, and classifies and screens different test results. The chip wafer is loaded with blue film, and the CHIP-ID is automatically identified and tested via memory-matching. Chips are peeled off by a blue film ejector, sucked by a nozzle, and transported by a manipulator to the high/normal temperature test areas respectively for automatical positioning, testing, analyzing screening and manipulator transporting and classification. This equipment has the characteristics of high speed and high accuracy, and realizes a process with complex timing and strict logic. The equipment adopts eccentric cam drive, connecting rod and precision fixture, and cooperates with multi-axis motion, visual positioning and visual character matching, and has mass production capabilities.
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Application
The equipment is used for automatic test binning of bare chips. The spectrum and LIV parameter testing of edge emitting lasers under normal/high temperature conditions can be realized
Features
1. Support testing of LIV and spectrum-related parameters of Chip, and draw testing curves
2. Automatic loading of chip blue film, automatic identification of chip ID through visual system, the test bench supporting automatic secondary positioning of the chip under the camera, and precise control of probe power-on test
3. The probe is automatically pressed down for power-on, the probe pressure is adjustable, supporting real-time display of probe force
4. High/normal temperature test bench, temperature controlled by closed loop
5. Loading and transfer actions are synchronized, normal/high temperature stage tests are carried out in parallel, improving test efficiency. The loading nozzle uses self-weight pressure, without damaging the chip
6. Support one-to-two test bench spectroscopes to save system testing costs
7. Alarm and error correction functions for abnormal situations during production
8. Materials in contact with the BAR are made of anti-static materials and grounded, and are equipped with anti-static ion blowers
9. Support local and remote databases
10. Multi-dimensional adjustable measurement structure to meet users' measurement needs for chips of different specifications
11. Standard TO and chips can be used for calibration, and other process parameters can be set
12. Real-time dynamic prompts for important links during production
13. Materials in contact with the chips made of anti-static materials and grounded; the loading station is equipped with anti-static ion blowers
14. The software supports local and remote databasesSpecification
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086-27-8990 8766
