Data Communication Single-station Bar Tester-Module testing_TO testing

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Data Communication Single-station Bar Tester

Classification:

PSS EML BAR automatic tester is used for LD bar LIV curve, spectrum, backlight automatic measurement, EA power-on test, SOA power-on test. Fully automatic loading and unloading supports loading of various specifications of material boxes and unloading of various specifications of material boxes or blue film. The dual temperature test (normal/high temperature) is available. High temperature test temperature can be customized by the user. The measurement database is open to users for subsequent screening processes.

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- Commodity name: Data Communication Single-station Bar Tester
- 型号: PSS BAR-HT2101
- Describe: Data communication bar single-station test, supporting tests of optoelectronic characteristics such as LIV, spectrum and divergence angle
PSS EML BAR automatic tester is used for LD bar LIV curve, spectrum, backlight automatic measurement, EA power-on test, SOA power-on test. Fully automatic loading and unloading supports loading of various specifications of material boxes and unloading of various specifications of material boxes or blue film. The dual temperature test (normal/high temperature) is available. High temperature test temperature can be customized by the user. The measurement database is open to users for subsequent screening processes.

Application
The equipment is used for automatic testing of DFB/EML BAR. The spectrum and LIV parameter testing of edge emitting lasers under normal/high temperature conditions can be realized

Features
1. Support a variety of mainstream specifications of material boxes, fully automatic loading and unloading, avoiding the scrapping of bar chips caused by material transfer or manual operation

2. The loading & unloading material boxes are equipped with magnetic suction fixtures, supporting the rapid replacement of material boxes or blue film disks of different specifications
3. Support automatic loading of BAR, identification and positioning of the first chip, ID identification, automatic testing, automatic judgment of the completion of BAR testing and automatic unloading

4. The contact pressure between the nozzle, probe and BAR is adjustable
5. Support single probe, double probe, and multi-probe power-on forms

6. Support frontlight LIV curve, power, spectrum measurement, backlight power measurement, EA & SOA related tests and multi-parameter and multi-condition screening to screen out bad chips as much as possible to avoid flowing into the back-end process

7. Support MAP drawing to facilitate users to analyze the performance distribution of wafers

8. Support NG Chip dot marking and simple chip appearance inspection
9. Support normal/high temperature testing, normal temperature bench supporting temperature control
10. Multi-dimensional adjustable measurement structure meets users' measurement needs for bars of different specifications

Specification