Drawer-Type Module Temperature Cycling Burn-in System-Module testing_TO testing

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Drawer-Type Module Temperature Cycling Burn-in System

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PSS Optical Module Temperature Cycling Burn-in System (PSS MD3T1144) is applied for temperature cycling test and reliability analysis of optical modules. Adopting drawer-type TEC + liquid-cooling solution, it provides 3-4 V constant voltage and temperature cycling burn-in conditions, and supports bit-error test. Working current, voltage and ambient temperature of modules are monitored in real-time for automatic failure judgment. Monitoring data is stored in real-time to enable traceability of failed burn-in modules. DDM is used to record module voltage, temperature, bias current, transmitting power and receiving power. DDM is used to record module voltage, temperature, bias current, transmitting power, receiving power and optoelectronic bit-error rate.

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Specifications
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- Commodity name: Drawer-Type Module Temperature Cycling Burn-in System
- 型号: PSS MD3T1144
- Describe: Single module: max. 10A current; TEC + water-cooling temperature control, 20 ~ 85 °C; 144 pcs modules for simultaneous burn-in
PSS Optical Module Temperature Cycling Burn-in System (PSS MD3T1144) is applied for temperature cycling test and reliability analysis of optical modules. Adopting drawer-type TEC + liquid-cooling solution, it provides 3-4 V constant voltage and temperature cycling burn-in conditions, and supports bit-error test. Working current, voltage and ambient temperature of modules are monitored in real-time for automatic failure judgment. Monitoring data is stored in real-time to enable traceability of failed burn-in modules. DDM is used to record module voltage, temperature, bias current, transmitting power and receiving power. DDM is used to record module voltage, temperature, bias current, transmitting power, receiving power and optoelectronic bit-error rate.

Application
1. Online burn-in screening for modules in package types such as QSFP112, QSFP-DD, OSFP and OSFP-RHS (expandable packages)
2. Meet stringent test requirements for high-speed 800G/1.6T module products

Features
1. Deliver maximum output current of 12 A per single slot
2. Support voltage and current monitoring as well as protection
3. Large-capacity independent temperature zones for flexible selection, different modules and parameter settings configured for product burn-in
4. Adopt TEC + water-cooling thermal control solution, temperature range 20-85 ℃, product temperature uniformity ≤±3 ℃
5. Real-time data storage, tracing module SN to record voltage, temperature, bias current, transmitting power and receiving power via DDM
6. Support bit error rate test with optical loopback and electrical loopback
7. Support current-limiting protection with comprehensive EOS functions

Specification