Integrated Optical Module Burn-in System
Classification:
PSS optical module integrated burn-in system (PSS MBS12016/22016/32016) is used for burn-in screening and reliability analysis of optical modules. The system provides 3~4V constant voltage and high temperature burn-in conditions up to 120℃, while performing real-time monitoring and testing of the module's operating current, voltage, and working environment temperature, and automatically performs failure judgment. It stores monitoring data in real time, supports tracing of burn-in failure modules, and records module voltage, temperature, bias current, transmitting power, and receiving power via DDM.
- Application
- Characteristic
- Specifications
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Application
1. Support online burn-in screening of package types such as XFP, SFP+, QSFP+, QSFP-DD, OSFP and CFP (package expandable)
2. Support the stringent requirements of high-speed module product testingFeatures
1. The single board provides a maximum current of 24A
2. The voltage can be 3~4V
3. Support voltage and current monitoring
4. Support various module packages and protocols
5. Two independent burn-in chambers can be configured with different parameter burn-in products
6. The temperature can reach up to 120℃
7. The system dissipates heat through water circulation, automatically adjusts the burn-in thermal balance, makes full use of the module's own power consumption, and reduces the thermal power consumption of the burn-in chamber
8. Track the module SN number and record the voltage, temperature, bias current, transmitting power and receiving power via DDMSpecification
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Product Features
• Provides a maximum current of 24A for the entire board for optical modules or COB products
• High-power aging supports water cooling solutions
• High integration and high reliability, suitable for mass production aging and reliability verification processes of modules or COB products
• The temperature chamber has two independent temperature zones, supporting the aging operation of various products simultaneously, with uniform temperature distribution and small temperature difference between modules
• Supports current limiting protection, real-time product protection, and complete EOS functions for module power on/off and hot-swapping of the aging board
• Supports real-time monitoring of DDM records such as voltage, temperature, bias current, transmit power, and receive power for modules and COB products
• Supports pre-aging register writing (aging mode) for modules and COB products, and single product register debugging function
• Separated aging board design, with QSFP and QSFPDD sockets as independent sub-boards for easy maintenance
• Real-time data storage, no need to worry about data loss due to unexpected power outages -
Parameters
Indicators
Product Model
MBS12016
MBS22016
MBS32016
Number of Independent Temperature Zones
2
Number of Test Channels
1008*2
(Maximum 2016 channels, refer to product type size and power consumption, select different types of aging boards and number of channels)
Chamber Scale
Single chamber supports 3*12 aging boards
Single chamber supports 6*6 aging boards
Module Packaging Support
Supports XFP, SFP, QSFP, QSFP-DD, OSFP, etc. (packaging can be expanded)
Voltage Output Range
3~4V
Voltage Monitoring
3~4V
Current Limit Range
0~4A
Current Monitoring
0~4A
Maximum Current per Board @3.3V
12A
12A
24A
I2C DDM Data Reading
Supports 8472 protocol, 8436 protocol, cmis4.0 protocol (expandable)
Overcurrent Protection
Software Configurable
Temperature Range
RT+30℃～120℃ (no-load)
Temperature Accuracy
±2℃
Temperature Uniformity [Air]
Full load ≤±3℃, no-load ≤±2℃
Long-term Temperature Stability
±1℃
Heating Rate
＞2℃/min
Database
Real-time local storage, can be connected to the database
Power Consumption
≤10kW (peak power consumption during equipment heating phase, excluding products)
Dimensions (Width*Height*Depth)
1620*1850*1450(mm)
1700*1900*1300(mm)
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086-27-8990 8766
