LD Integrated Burn-in System-Module testing_TO testing

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LD Integrated Burn-in System

Classification:

LD integrated burn-in system is used for burn-in screening and reliability life analysis of various types of packaged LD devices. The system can configure the pin definition through software and provide a drive current of up to 500mA and a high temperature burn-in condition of 150℃. At the same time, it can monitor and test the drive current, backlight current and threshold of the device in real time, and automatically judge the product failure. It stores monitoring data in real time and supports data tracing of burn-in and failed devices. It supports a single burn-in of up to 3072pcs.

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- Commodity name: LD Integrated Burn-in System
- 型号: PSS LDBI13003
- Describe: LD drive current ≤250mA, LD forward voltage ≤3V, PD reverse voltage ≤5V, PD monitoring current ≤2000uA, up to 3072PCS single burn-in
LD integrated burn-in system is used for burn-in screening and reliability life analysis of various types of packaged LD devices. The system can configure the pin definition through software and provide a drive current of up to 500mA and a high temperature burn-in condition of 150℃. At the same time, it can monitor and test the drive current, backlight current and threshold of the device in real time, and automatically judge the product failure. It stores monitoring data in real time and supports data tracing of burn-in and failed devices. It supports a single burn-in of up to 3072pcs.

Application
1. Integrated burn-in chamber used for burn-in screening of LDTO devices in mass production
2. Long-term reliability failure test analysis

Features
1. Integrated burn-in chamber provided with two independent chambers, which can be completely independently controlled, with high heating speed and efficiency without overshoot
2. ACC constant current mode and APC constant backlight mode optional
3. The burn-in board, as a universal carrier, can realize direct material transfer between different stations such as disk testing and burn-in, improving production efficiency
4. Support hot-swap and reliable ESD/EOS protection to ensure the safety of devices during burn-in
5. Support lm sweeping to calculate Ith
6. Software switching supporting burn-in of various types of packaged LD devices
7. Each burn-in board configured with different parameters for burn-in, stable and reliable burn-in parameters

Specification
1. The integrated aging chamber has two independent chambers, allowing for completely independent control, high heating speed efficiency, and no overshoot.
2. ACC constant current mode and APC constant backlighting mode are optional.
3. The aging board, as a universal carrier, enables direct material transfer between different testing and aging workstations, improving production efficiency.
4. Supports hot-swapping, reliable ESD/EOS protection, ensuring the safety of devices during aging.
5. Supports lm scanning to calculate Ith.
6. Software switching supports aging of various types of packaged LD devices.
7. Each aging board can be configured with different parameters for aging, ensuring stable and reliable aging parameters.