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Reliability Test
Key words:
The Proses COCBI aging system is a high-power COC aging system that supports high-current, narrow-pulse power-on aging. It is used for long-term reliability testing of COC chips under high-temperature and stable-current conditions. It supports pre-light power detection, software real-time monitoring of aging process data, and allows users to perform life analysis and aging screening on chips. The entire machine adopts a drawer-type layout, supporting up to 10 layers and 40 aging drawers. The number of layers in the aging chamber can be configured according to the specific aging scale requirements.
Key words:
LD integrated aging system, used for aging screening and reliability life analysis of various types of packaged LD devices. The system can configure pin definitions through software and provide a drive current of up to 500mA and high-temperature aging conditions of 150℃. It also performs real-time monitoring and testing of the device's drive current, backlight current, and threshold, and automatically judges product failures. Real-time storage of monitoring data supports data tracing of aged and failed devices. Supports a maximum of 3072 devices for single aging run.
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The Prases EML TO Integrated Aging Test System is used for aging screening and reliability life analysis of EML TO devices. The system supports aging of up to 1536 devices. It uses external environmental temperature control or high-temperature control of the internal TEC of the device, providing a constant current to the LD device to achieve aging of the EML device. The system can display in real time parameters such as aging current, backlight current, forward voltage, and EA current, and displays them graphically for intuitive observation, facilitating the observation of abnormal situations during the aging process. The universal aging board is compatible with our company's EML TO tray testing system, significantly improving testing efficiency and TO product quality.
Key words:
The APD integrated aging system is used for reliability assessment and aging screening of APD, APD-TIA, PIN, and PIN-TIA TO devices in the optical communication industry, supporting up to 3072 devices simultaneously. The system can provide constant current of 2mA, constant voltage of 5V, and high-temperature aging conditions of 175℃, while simultaneously monitoring the device's VBR and TIA current in real time and automatically judging product failure. Real-time storage of monitoring data supports traceability of aged and failed devices, effectively improving the efficiency and reliability of TO production and significantly increasing device testing output and quality.
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