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Reliability Test
Key words:
APD integrated burn-in system is used for reliability evaluation and burn-in screening of TO devices such as APD, APD-TIA, PIN, and PIN-TIA in the optical communication industry, and supports a single burn-in of up to 3072pcs. The system can provide 2mA constant current, 5V constant voltage and 175℃ high temperature burn-in conditions, while monitoring the VBR and TIA current of the device in real time, and automatically judge product failure. Real-time storage of monitoring data and support for tracing of burn-in and failed devices can effectively improve the efficiency and reliability of TO production, and greatly improve the output and quality of device testing.
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COC Drawer-type Burn-in System
PSS COCBI Burn-in System is a high-power COC burn-in system that supports high-current, narrow-pulse power-on burn-in. It is used for long-term reliability experiments of COC chips under high temperature and stable current conditions. It supports front-light power detection, software monitoring the burn-in process data in real time and users to perform life analysis and burn-in screening on chips. The whole machine adopts a drawer-type layout, supporting up to 10 layers and 40 burn-in drawers, and the number of layers of the burn-in box can be configured according to the specific burn-in scale requirements.
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LD integrated burn-in system is used for burn-in screening and reliability life analysis of various types of packaged LD devices. The system can configure the pin definition through software and provide a drive current of up to 500mA and a high temperature burn-in condition of 150℃. At the same time, it can monitor and test the drive current, backlight current and threshold of the device in real time, and automatically judge the product failure. It stores monitoring data in real time and supports data tracing of burn-in and failed devices. It supports a single burn-in of up to 3072pcs.
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PSS EML TO integrated burn-in test system is used for burn-in screening and reliability life analysis of EML TO devices. The system supports burn-in of up to 1536-channel devices. It provides constant current for LD devices through external environmental temperature control or high temperature control of the internal TEC of the device to achieve burn-in of EML devices. The system can display parameters such as burn-in current, backlight current, forward voltage, EA current in real time and display them in graphical form, which is convenient for observing abnormal conditions during burn-in process. The universal burn-in board is compatible with our EML TO disk test system, significantly improving test efficiency and TO product quality.
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