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Data Communication VCSEL Wafer Testing

Data Communication VCSEL Wafer Testing

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PSS WT-8502

PSS optical communication VCSEL tester is used for Wafer testing of surface-emitting VCSELs. It supports LIV and spectrum-related parameter testing of chips, automatic visual recognition, and fully automatic testing of each chip. It supports both normal temperature and high temperature testing. The high temperature test temperature can be customized by the user. It is compatible with Wafers of various sizes. The measurement database is open to users for subsequent screening processes.

850nm VCSEL wafer test, supporting tests of LIV and spectrum related parameters

VCSEL Wafer Testing for LiDAR

VCSEL Wafer Testing for LiDAR

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PSS WT-VL602

PSS high-power VCSEL tester is used for Wafer testing of vertical cavity surface emitting laser chips. It supports the testing of parameters such as LIV, spectrum, near field and far field with a pulse width of 100ns and a maximum current of 30A. It can automatically identify each chip with vision and complete the test automatically. It supports Chuck setting of 25~85℃ temperature testing. It is provided with 6-inch Wafer testing as a standard, and is compatible with 2-inch and 4-inch wafer and fragment testing. The measurement database is open to users for subsequent screening processes.

LiDAR VCSEL wafer test, supporting tests of LIV, spectrum, NF, and FF related parameters

COC Drawer-type Burn-in System

COC Drawer-type Burn-in System

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PSS LRS13841

PSS Drawer-type COC Burn-in System (PSS LRS13841) is commonly used for burn-in screening and lifetime reliability analysis of DFB, EML and EML-SOA chips. The system supports synchronous output of constant current (LD & SOA) and constant voltage (EA), and real-time monitoring of parameters such as current, voltage, optical power and temperature to automatically determine product failure. It supports local and remote databases for data analysis and traceability of failed devices.

Single-channel current ≤500mA; voltage ≤5V; supporting 40 temperature control units, simultaneous burn-in of up to 3840PCS COCs

LD Integrated Burn-in System

LD Integrated Burn-in System

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PSS LDBI13003

LD integrated burn-in system is used for burn-in screening and reliability life analysis of various types of packaged LD devices. The system can configure the pin definition through software and provide a drive current of up to 500mA and a high temperature burn-in condition of 150℃. At the same time, it can monitor and test the drive current, backlight current and threshold of the device in real time, and automatically judge the product failure. It stores monitoring data in real time and supports data tracing of burn-in and failed devices. It supports a single burn-in of up to 3072pcs.

LD drive current ≤250mA, LD forward voltage ≤3V, PD reverse voltage ≤5V, PD monitoring current ≤2000uA, up to 3072PCS single burn-in

EML Integrated Burn-in System

EML Integrated Burn-in System

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PSS EMLBI11536/PSS EMLBI21536

PSS EML TO integrated burn-in test system is used for burn-in screening and reliability life analysis of EML TO devices. The system supports burn-in of up to 1536-channel devices. It provides constant current for LD devices through external environmental temperature control or high temperature control of the internal TEC of the device to achieve burn-in of EML devices. The system can display parameters such as burn-in current, backlight current, forward voltage, EA current in real time and display them in graphical form, which is convenient for observing abnormal conditions during burn-in process. The universal burn-in board is compatible with our EML TO disk test system, significantly improving test efficiency and TO product quality.

LD drive current ≤250mA, SOA drive current ≤250mA, PD reverse voltage ≤5V, LD forward voltage ≤5V, EA voltage 0~-5V, up to 1536PCS single burn-in

APD Benchtop Burn-in Monitoring Power Supply

APD Benchtop Burn-in Monitoring Power Supply

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PSS APDBI-IV

PSS APD benchtop burn-in monitoring power supply (PSS APDBI-IV) is mainly used for reliability evaluation and burn-in screening of APD and APD-TIA devices to improve product quality. The system provides constant current to APD and constant voltage to TIA to achieve device burn-in. At the same time, it can control the working environment temperature of the device with independent customer-supplied burn-in chamber to achieve the function of working burn-in under high temperature. During the burn-in process, the VBR and TIA current of the device are monitored and tested in real time, and the product failure judgment is automatically performed.

APD constant current ≤ 2mA, APD voltage measurement 0~70V, TIA constant voltage ≤ 5V, VPD voltage ≤ 20V, PD current measurement 200uA, up to 64PCS single burn-in

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